Laser equipment enables IC erasure and rework.
In the semiconductor packaging and electronics manufacturing industry, laser marking (marking) on the surface of ICs (integrated circuits) is crucial for product traceability, quality management, and brand identification. When marking errors, serial number discrepancies, or special circumstances, such as military supplies or sensitive products, occur, traditional grinding, chemical cleaning, or mechanical scrapping methods can easily damage the package, cause contamination, or even lead to the scrapping of the entire batch. Modern laser IC erasure equipment , equipped with precise re-marking capabilities, provides a non-contact, high-efficiency rework solution for IC erasure, making it the preferred technology for industrial rework.
Laser IC erasure utilizes high-energy lasers to precisely remove surface layers (such as epoxy resin or coatings) while minimizing the heat-affected zone, thus avoiding damage to internal chips, bonding wires, or solder pads. After erasure, the laser re-etches, generating new IC serial numbers, batch numbers, logos, or QR codes , achieving a truly one-stop service.
Core advantages include:
Non-contact: Will not scratch the surface or cause package deformation, suitable for various packaging types such as BGA, QFP, QFN, SOP, DIP, etc.
High precision and repeatability : The light spot is controlled to the micron level, and the erasure range can selectively process a single character or the entire surface of the mark. The re-engraved characters are clear, have high contrast, and meet traceability standards.
Low thermal impact and high safety : Short pulse and precise energy control significantly reduce the risk of thermal damage to ICs and can be combined with ESD protection procedures.
Environmentally friendly and efficient : No chemical solvents are required, there is no waste liquid pollution, the processing speed is fast, and it is suitable for small-batch to medium-to-large-batch production.
Reduce scrap costs : High-value ICs that would otherwise be scrapped due to printing errors can be directly returned to the production line after laser erasure and re-etching, significantly improving yield and capacity utilization.
Typical application scenarios
Correction of printing errors on the production line : If the serial number, date code or batch number is entered incorrectly during mass production, the incorrect mark should be immediately erased with a laser IC and then the correct information should be reprinted.
Customization and revision needs : When customers temporarily change their logo, specifications, or serial number format, we can quickly erase the IC surface and engrave new markings.
Rework and repair process : ICs that need to be re-marked after fault analysis, or inventory items that need to be renumbered.
Quality improvement and readability optimization : When old markings are blurry or lack contrast, they are erased and re-engraved to ensure that they are clear for both scanning and visual viewing.
Sensitive products: When military supplies or special product models require the concealment of model information, laser removal can be used.
To prevent reverse engineering: To prevent others from copying the circuit, related information is erased.
Professional laser IC erasure equipment and laser marking machine integrated systems typically have:
Highly stable laser source with adjustable power (commonly 20W–100W levels, select according to application).
High-precision galvanometer scanning and visual positioning
The software allows for flexible configuration of erase parameters and content rewriting (supports automatic serial numbers, Data Matrix, and QR Code).
Real-time monitoring and parameter memory facilitate quick switching between different products.
Contact us now for free sampling services and professional consultation to help you choose the most suitable model.
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